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Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static & Dust-Proof Design and Customizable Cavity Size

Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static & Dust-Proof Design and Customizable Cavity Size

브랜드 이름: Hiner-pack
모델 번호: HN24191
모크: 500 PC
가격: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: 티/티
공급 능력: 2000pcs/일
자세한 정보
원래 장소:
중국
인증:
ROHS, ISO
트레이 중량:
다양함, 일반적으로 캐비티당 최대 500그램
색상:
검은색
품질 보증:
납품 보장, 신뢰할 수 있는 품질
윤곽선 크기:
50.8×50.8×3.94mm
공진기 크기:
8.76x5.51x0.685mm
인코텀즈:
EXW, FOB, CIF, DDU, DDP
금형 유형:
주입
재사용 가능:
접시 형태:
직사각형
청정 등급:
일반적이고 초음파 세척
IC 유형:
BGA,QFP,QFN,LGA,PGA
포장 레벨:
운송 패키지
뒤틀림:
변형 MAX 0.26mm
용량:
4x6=24개
포장 세부 사항:
판지, 팔레트
공급 능력:
2000pcs/일
강조하다:

Fine Pitch IC Components ESD Waffle Trays

,

Anti-Static & Dust-Proof Waffle Pack Chip Trays

,

Customizable Cavity Size IC Component Trays

제품 설명
Professional ESD Waffle Trays for Fine Pitch IC Components
Features precision waffle structure to hold fine pitch ICs stably. Effectively blocks particulate contamination and avoids ESD damage during whole process. Made of durable anti-static material to maintain stable performance in various working conditions.

Matches well with automatic production and processing lines. Works smoothly in chip loading, transferring and sorting. Improves operation efficiency and ensures component integrity in daily production.

Accepts full customization on cavity size and arrangement to fit different components. Focuses on safe protection and efficient packaging. Provides professional solutions for high-precision semiconductor applications.
Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24191
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 8.76x5.51x0.685 mm
Matrix QTY 4x6=24 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for high-precision chip processing, component sorting, chip testing and small device assembly. Works well in automatic production lines and static controlled workshops.

Ideal for factory internal transportation, finished product storage and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants and electronic component suppliers.
Packaging & Shipping/ Services
Supports customized packaging plans to ensure safe delivery. Protects trays from deformation and damage during long distance transportation.

Provides stable and reliable packaging solutions for bulk orders. Helps maintain product quality and arrives in good condition for customers.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers