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Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

브랜드 이름: Hiner-pack
모델 번호: HN24190
모크: 500 PC
가격: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: 티/티
공급 능력: 2000pcs/일
자세한 정보
원래 장소:
중국
인증:
ROHS, ISO
트레이 중량:
다양함, 일반적으로 캐비티당 최대 500그램
색상:
검은색
품질 보증:
납품 보장, 신뢰할 수 있는 품질
윤곽선 크기:
50.8×50.8×4mm
공진기 크기:
2.2x1.35x0.53mm
인코텀즈:
EXW, FOB, CIF, DDU, DDP
금형 유형:
주입
재사용 가능:
접시 형태:
직사각형
청정 등급:
일반적이고 초음파 세척
IC 유형:
BGA,QFP,QFN,LGA,PGA
포장 레벨:
운송 패키지
뒤틀림:
변형 MAX 0.23mm
용량:
10x9=90개
포장 세부 사항:
판지, 팔레트
공급 능력:
2000pcs/일
강조하다:

Anti-Static Waffle Pack Chip Trays

,

Reusable Semiconductor IC Trays

,

Customizable Cavity Size IC Chip Trays

제품 설명
ESD Anti Static Semiconductor Waffle Chip Trays

Deliver precise waffle structure to cradle delicate IC chips tightly, eliminating movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.


Integrate seamlessly with automated packaging lines and cleanroom workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.


Support full customization of cavity size, spacing, and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Anti-static protection
  • Suitable for Delicate Fine Pitch ICs
  • Secure chip holding
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24190
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×4 mm
Cavity Size 2.2x1.35x0.53 mm
Matrix QTY 10x9=90 PCS
Warpage MAX 0.23mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Support semiconductor wafer dicing, die sorting, device testing, and precision component kitting operations. Work seamlessly with automated pick-and-place systems, ESD-controlled production lines, and clean manufacturing environments


Also applied in inter-plant component transfer, international shipping of sensitive chips, and long-term inventory storage. Serve semiconductor fabs, IC packaging facilities, and global electronic component distributors.

Packaging & Shipping/ Services
Provide fully customized solutions for anti-static waffle pack trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers