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ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

브랜드 이름: Hiner-pack
모델 번호: HN24175
모크: 500 PC
가격: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: 티/티
공급 능력: 2000pcs/일
자세한 정보
원래 장소:
중국
인증:
ROHS, ISO
트레이 중량:
다양함, 일반적으로 캐비티당 최대 500그램
색상:
검은색
품질 보증:
납품 보장, 신뢰할 수 있는 품질
윤곽선 크기:
50.7×50.7×7.4mm
공진기 크기:
1.30x1.15x0.72mm
인코텀즈:
EXW, FOB, CIF, DDU, DDP
금형 유형:
주입
재사용 가능:
접시 형태:
직사각형
청정 등급:
일반적이고 초음파 세척
IC 유형:
BGA,QFP,QFN,LGA,PGA
포장 레벨:
운송 패키지
뒤틀림:
변형 MAX 0.2mm
용량:
17x18=306개
포장 세부 사항:
판지, 팔레트
공급 능력:
2000pcs/일
제품 설명
ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.


It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.


It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Withstands 125℃ high temperatures.
  • Offers secure IC chip storage.
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24175
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 1.30x1.15x0.72 mm
Matrix QTY 17x18=306 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
It applies to semiconductor encapsulation, IC testing, die sorting, and wafer processing. It adapts to high-precision manufacturing and cleanroom operations.


It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.

Packaging & Shipping/ Services
Custom cross-slot waffle tray services are available. Tailor cavity size, layout, and material for specific IC models. Create exclusive solutions to meet unique semiconductor packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers