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Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

브랜드 이름: Hiner-pack
모델 번호: HN24146
모크: 500 PC
가격: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: 티/티
공급 능력: 2000pcs/일
자세한 정보
원래 장소:
중국
인증:
ROHS, ISO
트레이 중량:
다양함, 일반적으로 캐비티당 최대 500그램
색상:
검은색
품질 보증:
납품 보장, 신뢰할 수 있는 품질
윤곽선 크기:
50.8×50.8×4.36mm
공진기 크기:
1.08x1.08x2.18mm
인코텀즈:
EXW, FOB, CIF, DDU, DDP
금형 유형:
주입
재사용 가능:
접시 형태:
직사각형
청정 등급:
일반적이고 초음파 세척
IC 유형:
BGA,QFP,QFN,LGA,PGA
포장 레벨:
운송 패키지
뒤틀림:
변형 MAX 0.26mm
용량:
15x15=215개
포장 세부 사항:
판지, 팔레트
공급 능력:
2000pcs/일
제품 설명
Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

High-Precision Cleanroom Waffle Pack IC Trays adopt dense precise grid cavity structure, meeting strict cleanroom industry standards.


With excellent contamination control & dust-proof performance, the trays provide stable safe handling, storage and transportation protection for delicate ESD-sensitive fine pitch semiconductor IC chips.


They are perfectly suitable for semiconductor manufacturing, packaging, inspection & testing processes, and support fully customized cavity size & layout designs to match various chip specifications.

Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • High-precision compact grid cavity structure
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24146
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×4.36 mm
Cavity Size 1.08x1.08x2.18 mm
Matrix QTY 15x15=215 PCS
Warpage MAX 0.25mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Cleanroom-grade Waffle Pack IC Trays provide full protection for semiconductor chips with contamination control & ESD anti-static performance.
  • Fine pitch IC packaging (QFN, BGA, CSP bare die)
  • JEDEC compatible automated pick-and-place lines
  • Semiconductor inspection & testing processes
  • Cleanroom IC logistics transportation & storage management
Packaging & Shipping/ Services
Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers