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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

브랜드 이름: Hiner-pack
모델 번호: HN24132
모크: 500 PC
가격: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: 티/티
공급 능력: 2000pcs/일
자세한 정보
원래 장소:
중국
인증:
ROHS, ISO
트레이 중량:
다양함, 일반적으로 캐비티당 최대 500그램
색상:
일반적으로 ESD 보호를 위해 검은색 또는 어두운 회색
품질 보증:
납품 보장, 신뢰할 수 있는 품질
공진기 크기:
5.0x3.35x1.20mm
인코텀즈:
EXW, FOB, CIF, DDU, DDP
금형 유형:
주입
재사용 가능:
접시 형태:
직사각형
청정 등급:
일반적이고 초음파 세척
IC 유형:
BGA,QFP,QFN,LGA,PGA
포장 레벨:
운송 패키지
뒤틀림:
변형 MAX 0.3mm
용량:
9x7=63개
포장 세부 사항:
판지, 팔레트
공급 능력:
2000pcs/일
제품 설명
Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays meet strict cleanroom industry standards. Trays provide professional contamination control performance, and offer safe stable handling for delicate fine pitch IC chips.


Cleanroom-Grade Waffle Pack Chip Trays adopt reliable JEDEC standard structure. Trays effectively avoid dust and pollution damage, and well protect precision semiconductor chips in manufacturing processes.


Cleanroom-Grade Waffle Pack Chip Trays deliver stable reliable chip carrier performance. Trays fit daily IC packaging, storage and transport work perfectly, keeping sensitive chips clean and intact.

Key Features/ Benefits 
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Safe Stable Semiconductor Handling
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24132
MaterialMPPO
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.7×50.7×7.4 mm
Cavity Size5.0x3.35x1.20 mm
Matrix QTY9x7=63 PCS
WarpageMAX 0.2mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Cleanroom-Grade Waffle Pack Chip Trays provide full reliable IC protection during semiconductor manufacturing and transportation. Trays own excellent contamination control performance, and perfectly protect ESD-sensitive fine pitch chip devices.

Trays are widely used for fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing work, as well as daily IC logistics and storage management.

Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers