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High Precision ESD Safe JEDEC Tray for Fine Pitch IC with Automation Compatibility

High Precision ESD Safe JEDEC Tray for Fine Pitch IC with Automation Compatibility

브랜드 이름: Hiner-pack
모델 번호: HN24239
모크: 500 PC
가격: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: 티/티
공급 능력: 2000pcs/일
자세한 정보
원래 장소:
중국
인증:
ROHS, ISO
트레이 중량:
다양함, 일반적으로 캐비티당 최대 500그램
색상:
일반적으로 ESD 보호를 위해 검은색 또는 어두운 회색
품질 보증:
납품 보장, 신뢰할 수 있는 품질
공진기 크기:
14x22x1.96mm
인코텀즈:
EXW, FOB, CIF, DDU, DDP
금형 유형:
주입
재사용 가능:
접시 형태:
직사각형
청정 등급:
일반적이고 초음파 세척
IC 유형:
BGA,QFP,QFN,LGA,PGA
포장 레벨:
운송 패키지
평탄:
0.76mm 미만
용량:
6x11=66개
포장 세부 사항:
판지, 팔레트
공급 능력:
2000pcs/일
강조하다:

ESD safe JEDEC IC tray

,

fine pitch IC storage tray

,

automation compatible JEDEC tray

제품 설명
High Precision JEDEC Tray for Fine Pitch IC

This JEDEC tray is designed for delicate, fine pitch ICs, ensuring stable positioning during automated pick-and-place, inspection, and transport. Its high-precision cavity minimizes chip movement and reduces defects.

Key Features/ Benefits
  • High precision cavities for fine pitch IC (≤0.5 mm)
  • ESD safe with surface resistance 1E4–1E11 Ω
  • Compatible with automation handling systems
  • Custom pockets available for various IC types
  • Durable material for long lifecycle
Specifications
Brand Hiner-pack
Model HN24239
Material ABS
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 14x22x1.96 mm
Matrix QTY 6x11=66 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices

  • Fine pitch IC packaging (QFN, BGA, CSP)
  • Automated pick-and-place systems
  • Semiconductor inspection & testing
  • IC logistics and storage
Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:

Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers