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| 브랜드 이름: | Hiner-pack |
| 모델 번호: | HN24140 |
| 모크: | 500pcs |
| 가격: | $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities） |
| 지불 조건: | 100% Prepayment |
| 공급 능력: | 2000PCS/Day |
High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven
This ESD-Safe JEDEC Tray is specifically designed for the protection and handling of semiconductor devices across automated manufacturing lines. Built from high-performance conductive polymer, it ensures stable electrostatic control while maintaining precise pocket geometry for secure part retention. Its rigid structure and uniform layout provide reliable compatibility with robotic arms, pick-and-place systems, and tray elevators, making it an ideal solution for high-volume, precision-driven production environments.
JEDEC Standard Compliance – Fully meets JEDEC outline specifications to ensure interchangeability with global handling and packaging systems.
Excellent ESD Protection – Conductive material effectively dissipates static charges, protecting sensitive components during every stage of handling.
Precision-Molded Pockets – Consistent pocket design minimizes component movement, ensuring accurate placement during transport or inspection.
Automation Adaptability – Compatible with robotic sorting systems and tray stackers to streamline automated workflows.
Reinforced Frame Design – Strengthened edges reduce flexing and warping, maintaining dimensional accuracy through repeated cycles.
Stacking Efficiency – Interlocking edges enable stable vertical stacking, simplifying storage and transport logistics.
| Brand | Hiner-pack |
| Model | HN24140 |
| Material | MPPO |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 5.0*6.4*1.03mm |
| Matrix QTY | 11*28=308PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
This tray can be modified to accommodate unique device specifications or process needs:
Custom Pocket Geometry – Designed for chips, modules, or special-shaped components requiring non-standard cavity profiles.
Color Options – ESD-safe materials can be customized in various colors for product or batch distinction.
Permanent Marking Options – Incorporate molded batch codes, serial numbers, or customer logos for traceability.
Automation Interface Options – Optional indexing holes, tabs, or side cutouts for enhanced robotic or conveyor integration.
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