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Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

브랜드 이름: Hiner-pack
모델 번호: HN25064
모크: 1000 Pcs
가격: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: T/T
공급 능력: 4000PCS~5000PCS/per Day
자세한 정보
원래 장소:
중국 심천
인증:
ISO 9001 ROHS SGS
선택 과목:
뚜껑/덮개 및 클립/클램프
성형 방법:
인젝션 성형
재산:
ESD, 논-ESD
warpage:
<0.3mm
모양:
직사각형
맞춤형 로고:
사용 가능
내열성:
Packaging Details:
It Depends On The QTY Of Order And Size Of Product
Supply Ability:
4000PCS~5000PCS/per Day
강조하다:

Bare Die Tray 11x13 capacity

,

Semiconductor industry die tray

,

143PCS bare die storage

제품 설명

Product Description:

As a leading provider in the semiconductor packaging and testing industry, our firm has innovatively crafted the Die Carrier Series, tailored to fulfill the exacting demands of advanced semiconductor manufacturing. Aligning with the worldwide Semiconductor industry towards miniaturization and heightened integration, we have thoroughly comprehended the rigorous market specifications for chip packaging solutions, resulting in a comprehensive portfolio encompassing chips of all sizes. This offering boasts permanent antistatic properties, dust resistance, and robust durability, alongside unparalleled dimensional precision.


Features:

  • Product Name: Bare Die Trays
  • Customizable Logo: Available
  • Molding Method: Injection Moulding
  • Heat Resistant: Yes
  • Stackable: Yes
  • Esd Protection: Yes

Applications:

♦Temporary Storage in Semiconductor Production:

During the manufacturing and packaging of semiconductor chips, it can effectively protect the chips from physical damage and electrostatic discharge, ensuring the integrity and reliability of the chips throughout the manufacturing and packaging process.


♦Chip Transportation and Distribution:

As a professional packaging container, the bare die tray can effectively protect the chips during transportation, reducing the risk of chip failure due to physical damage or electrostatic discharge.

Customization:

Brand Name: Hiner-pack

Model Number: HN25064

Place Of Origin: Shenzhen, China

Packaging Details: It Depends On The QTY Of Order And Size Of Product

Molding Method: Injection Moulding

Heat Resistant: Yes


Outline Line Size

101.6*101.6*6mm

Brand

Hiner-pack

Model

HN 25064

Package Type

FBGA IC

Cavity Size

5.7*4.2*2.25mm

Matrix QTY

11*13=142PCS

Material

ABS,PC

Flatness

MAX 0.3mm

Color

Black

Service

Accept OEM,ODM

Resistance

1.0x10e4-1.0x10e11Ω

Certificate

ROHS

Packing and Shipping:

♠Product Packaging:

The Bare Die Trays are carefully placed in individual compartments within a sturdy cardboard box to ensure safe transportation.


♠Shipping:

Once packed, the Bare Die Trays are sealed and labeled for shipping. They are then securely placed in a shipping box along with any necessary packing materials to prevent damage during transit.