Brief: Discover our Custom Cavity Size IC Component Trays designed for JEDEC Standard Compatibility. These trays are molded from high-performance polymers, offering excellent dimensional stability and ESD protection. Ideal for semiconductor assembly, inspection, and automated test workflows, they ensure secure component handling and seamless integration with industry equipment.
Related Product Features:
Compliant with JEDEC tray standards for universal handling compatibility.
ESD-safe conductive material neutralizes static buildup for safe handling.
Precision-molded pockets minimize part movement during automated processes.
Automation-ready design with pickup-friendly surfaces and alignment-friendly geometry.
Durable construction maintains shape and integrity through repetitive use.
Interlocking perimeter features ensure stable stacking for transport and storage.
Customizable pocket configurations to accommodate specific device geometries.
Available in various ESD-safe color compounds for process tracking.
자주 묻는 질문:
What materials are used in these IC component trays?
The trays are molded from high-performance polymers, specifically MPPO, which offers excellent dimensional stability and ESD protection.
Are these trays compatible with automated systems?
Yes, the trays are designed with automation in mind, featuring pickup-friendly surfaces and alignment-friendly geometry for seamless integration with robotic systems.
Can the trays be customized for specific component sizes?
Absolutely, customization options include modifying pocket layouts, shapes, or depths to accommodate specific device geometries, as well as choosing from various ESD-safe color compounds.