블랙 MPPO ESD 부품 트레이 BGA IC 장치에 대한 7.62mm 두께

샘플 디스플레이
June 12, 2024
Video Description:
Discover the Black MPPO ESD Component Tray, 7.62mm thick, designed for BGA IC Devices. Secure, stackable, and fully traceable, this JEDEC tray streamlines logistics in fast-paced manufacturing environments. Ideal for various IC packaging solutions.