웨플 팩 폼 프로세스

워크샵 디스플레이
October 07, 2023
Video Description:
Discover the WAFFLE PACK MOLD PROCESS for Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die. These anti-static JEDEC trays are designed for semiconductor packaging, offering reliable protection and convenience for small silicon dies. Ideal for MPW processes, these trays ensure safe transit and transport with customizable options.