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180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

브랜드 이름: Hiner-pack
모델 번호: HN24220
모크: 500 PC
가격: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
지불 조건: 티/티
공급 능력: 2000pcs/일
자세한 정보
원래 장소:
중국
인증:
ROHS, ISO
트레이 중량:
다양함, 일반적으로 캐비티당 최대 500그램
색상:
일반적으로 ESD 보호를 위해 검은색 또는 어두운 회색
품질 보증:
납품 보장, 신뢰할 수 있는 품질
공진기 크기:
4x5x1.6mm
인코텀즈:
EXW, FOB, CIF, DDU, DDP
금형 유형:
주입
재사용 가능:
접시 형태:
직사각형
청정 등급:
일반적이고 초음파 세척
IC 유형:
BGA,QFP,QFN,LGA,PGA
포장 레벨:
운송 패키지
평탄:
0.76mm 미만
용량:
13x28=364개
포장 세부 사항:
판지, 팔레트
공급 능력:
2000pcs/일
강조하다:

180°C high temp JEDEC tray

,

ESD protection JEDEC IC tray

,

semiconductor packaging JEDEC tray

제품 설명
High Temp ESD JEDEC Tray for AI Chips Packaging
This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging.
It ensures dimensional stability and precise positioning during automated handling.
Key Features/ Benefits 
  • Up to 180°C high temperature resistant (PEI material)
  • Stable ESD protection (1E4–1E11 Ω)
  • Compatible with ASM / Advantest / YAMAHA machines
  • Free design within 24 hours
  • JEDEC standard footprint
Specifications
Brand Hiner-pack
Model  HN24220
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 4x5x1.6 mm
Matrix QTY 13x28=364 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
  • AI chips / GPU / ASIC
  • BGA / QFN / IC packaging
  • Burn-in & baking process
  • Production line buffering
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • 10+ years semiconductor packaging experience
  • In-house mold design capability
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Daily capacity: 2000+ pcs